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EDAPS 2018_Call for Papers

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張貼人:網站管理員公告日期:2018-08-28
IEEE EPS
CALL FOR PAPERS
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium has been one of the main events in the Asia Pacific region with a focus on the electrical design of chip, package and systems for electronics applications. For more than a decade, this symposium has attracted world class researchers from both academia and industry to share their state-of-the-art results in chip, package and printed circuit board design and measurements.

DEADLINES
  1. Prospective authors should submit a three-page manuscript by September 10, 2018.
  2. Notification about acceptance will be given by September 21, 2018.
  3. Accepted papers will be reproduced as-is in the Conference Proceedings.
  4. In addition, authors of accepted papers will be invited to submit an extended version of their manuscript for a Special Section based on EDAPS-2018 to be published in the IEEE Transactions on components, packaging and manufacturing technology (T-CPMT).
For a PDF version of the call for papers, please click here.

The symposium will include both oral and poster sessions. In addition, a number of prominent experts will be giving keynote lectures and tutorials on areas of emerging interest. The official language is English.

TOPICS
  1. 3D-ICs/TSVs/Interposers
  2. Testing on 3D-IC and SiP
  3. Signal and Thermal Integrity
  4. Power Integrity/Power Distribution Networks (PDNs)/Ground Noise
  5. Computational Electromagnetics and Multi-physics Methods for SI/PI/TI Analysis
  6. Thermal Management Design for 3D-ICs and SiP
  7. Design and Modeling for High-speed Channels and Interconnects
  8. High speed serial links jitter budgeting
  9. Jitter segregation algorithms and tools
  10. Time / Frequency Domain Measurement Techniques
  11. Power supply induced jitter and transfer functions.
  12. Nanoelectronics for 3D-ICs and SiP
  13. Machine Learning applied to packaging
  14. Active Devices and Circuit Modeling Technologies
  15. Electronic Packages, SiP/ SoP
  16. IC and Package Level EMC
  17. Antennas in Packages (AiP)
  18. RF/mm-wave and THz Packages
  19. Miniaturized and Embedded Passives
  20. Power Electronic Packages
  21. Advanced Simulation Tools and CAD
  22. Substrate Technology for Packages and PCBs
  23. Electrical Design of Flexible Devices and Sensing
  24. 2-D Materials for 3D-ICs and SiP
  25. 3-D ICs and SiP Reliability
  26. Electrical Design for 5G Wireless Communication
  27. DDR’s Signal and Power integrity considerations
  28. Others
STUDENT TRAVEL GRANTS ‐ A limited number of travel grants will be provided to support students of accepted papers. Selection will be based on papers submitted and requires paper presentation by the student at the conference.

Final Deadline: September 10, 2018

Submission Format: 2 column, 3-page, PDF format only.


Submitted manuscripts should be camera ready and compliant with the general standards of the IEEE, including appropriate referencing. Noncompliant manuscripts will not be considered for review.

Location: Chandigarh, India

Exhibits: EDAPS-2018 will be exciting forum for vendors to demonstrate their state-of-the-art-tools to the attendees. Interested vendors can contact the conference administration for more details.

For more information, please contact: edaps2018@emlab.illinois.edu
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最後修改時間:2018-08-28 PM 4:30

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